Add to wishlist

DC-18GHz SPST MMIC

$45.35

– Part No.: YSW04-001811C1
– Manufacturer: YFEEN
– Operating Frequency range: DC~18GHz
– Insertion loss: 2.0dB, Isolation: 55dB
– On / off VSWR: 1.4/1.4, Switching speed: 20ns
– Chip size: 1.5mm x 1.0mm x 0.1mm

Quantity	Discount (%)	Price
1 - 24	—	$45.35
25 - 99	6.66 %	$42.33
100 - 499	12.5 %	$39.68
500 - 999	19.98 %	$36.29
1,000 - 1,999	31.38 %	$31.12
2,000+	44.12 %	$25.34

YSW04-001811C1 is a FET matched single pole single throw switch MMIC, with frequency range covering DC-18GHz, insertion loss of 2.0db, and switch is controlled by logic control of -5v/0v level. The back of the chip is both DC and AC.

Feature

Operating Frequency range: DC~18GHz
Insertion loss: 2.0dB
Isolation: 55dB
On / Off VSWR: 1.4/1.4
Switching speed: 20ns
Chip size: 1.5mm x 1.0mm x 0.1mm

APPLICATION

Radar system
Communication
Instruments

Absolute Maximum Ratings

Parameters	Symbol	Value
Control level range	VC1, VC2	-8V~0.5V
Maximum input power	Pin	+30dBm
Storage temperature	T_stg	-65°C~150°C
Ambient temperature	T_a	-55°C~125°C

* Exceeding any of the above maximum limits may cause permanent damage!

Electrical Characteristics（T_a =+25°C）

Parameters		Min.	Typ.	Max.	Unit
Operating Frequency range				18	GHz
Insertion loss			2.0		dB
Isolation	DC~8GHz		55		dB
Isolation	8GHz~18GHz		50		dB
On VSWR			1.4		―
Off VSWR			1.4		―

Caution: This device is a high-performance RF component and can be damaged by inappropriate handling. Standard ESD precautions should be followed.

Measurements

Ta = + 25°C on-wafer test

Insert loss

On input VSWR

On output VSWR

Isolation

Off input VSWR

Off output VSWR

Information

Physical Dimensions

Note: all dimensions are in micrometers (μm), size of PAD is 100×100 μm²

Suggested assembly drawing

PADs Defination

PAD	Function description
IN	RF signal input
OUT1, OUT2	RF signal output
VC1, VC2	Control port 0/-5V

TRUTH TABLE

State	VC1	VC2
On	0	-5
Off	-5	0

Datasheet & Order Code

Document Download

Datasheet Download

ORDERING INFORMATION

Part No.	Pkg.	Version	Part description
YSW04-001811C1	Bare die	C1	Chip size：1500µm x 1000µm (tolerance: ±15 µm) Thickness: 0.1mm, Material of BACK: TiAu

Cautions

1) It can be used in clean environment;

2) GaAs material is very brittle, and the surface of the chip is easy to be damaged, so we should be careful when using it;

3) Input and output are made of two bonding wires (diameter 25um gold wire), and the bonding line shall be as short as possible;

4) No direct capacitance at RF input / output;

5) The sintering temperature is lower than 300℃ with 80/20 tin, and the sintering time is as short as possible, and it should not exceed 30 seconds;

6) This product belongs to electrostatic sensitive device, pay attention to anti-static when storing and using;

7) Dry nitrogen environment storage.

Reviews

There are no reviews yet.