25-43 GHz Ultra Low Noise Amplifier
$170.07
– Operating frequency range : 25 to 43 GHz
– Noise Figure : 1.5 dB from 25 to 43 GHz, Gain : 32dB
– Input Return Loss : > 8 dB, Output Return Loss : > 8 dB
– Power Supply : 30 mA at 1.1V, Die size = 3 x 2 mm
– Tested, Inspected Known Good Die (KGD)
– Demonstration Boards available
The CGY2122XUH is a high-performance GaAs Low Noise Amplifier MMIC designed to operate in the Ka Band.
The CGY2122XUH has an exceptionally low noise figure of 1.5dB and 32dB of gain over the whole 25-43 GHz frequency band. The on chip matching provides 8 dB of Input Return Loss and Output Return Loss over the frequency range. It can be used in Radar, Telecommunication, and instrumentation applications.
The die is manufactured using OMMIC’s advanced 70nm gate length high indium contain MHEMT technology. The MMIC uses gold bonding pads and backside metallization and is fully protected with silicon nitride passivation to obtain the highest level of reliability.
Feature
-
Operating frequency range : 25 to 43 GHz
-
Noise Figure : 1.5 dB from 25 to 43 GHz
-
Gain : 32dB
-
Input Return Loss : > 8 dB
-
Output Return Loss : > 8 dB
-
Power Supply : 30 mA at 1.1V
-
Die size = 3 x 2 mm
-
Tested, Inspected Known Good Die (KGD)
-
Demonstration Boards available
APPLICATION
-
Radar
- Telecommunications
-
Instrumentation
- SATCOM
Maximum Values
Tamb = + 25°C, at Die backside; unless otherwise specified.
| Symbol | Parameter | Conditions | MIN. | MAX. | UNIT |
| VG1, VG2, VG3, VG4 | Gate voltage | – 2.5 | 0 | V | |
| VD1, VD2, VD3, VD4 | Drain voltage | 0 | 1.2 | V | |
| ID1, ID2, ID3, ID4 | Drain current | 50 | mA | ||
| IG1, IG2, IG3, IG4 | Gate Current | – 1 | + 1 | mA | |
| PIN | RF Input power | +1 | dBm | ||
| Tamb | Ambient temperature | -40 | +85 | °C | |
| Tj | Junction temperature | +175 | °C | ||
| Tstg | Storage temperature | -55 | +85 | °C |
Operation of this device outside the parameter ranges given above may cause permanent damage
Thermal Characterstics
| Symbol | Parameter | Value | UNIT |
| Rth (j-amb) | Thermal resistance from junction to ambient (DC power at Tamb max) | TBD | °C/W |
ELECTRICAL CHARACTERISTICS
Tamb = + 25°C, VD1, VD2, VD3, VD4 = 1.1V, ID1, ID2, ID3, ID4 = 7.5 mA, unless otherwise specified.
| Symbol | Parameter | Conditions | MIN. | TYP. | MAX. | UNIT |
| RFin | Input frequency | 25 | 43 | GHz | ||
| Performances on Reference Board at fi = 29 GHz | ||||||
| VD1, 2, 3, 4 | Drain Supply voltage | +1.1 | V | |||
| ID1, 2, 3, 4 | Total Supply current | VD1, 2, 3, 4 = 1.1 V | 30 | mA | ||
| G | Gain | 32 | dB | |||
| NFMIN | Minimum Noise Figure | @32GHz | 1.2 | dB | ||
| NF | Noise Figure | 1.5 | dB | |||
| P1dB | 1dB compression point | 1.2 | dBm | |||
| OIP3 | Output third order intercept point | 10 | dBm | |||
| ISOrev | Reverse Isolation | RFOUT/RFIN | -50 | dB | ||
| S11 | Input reflection coefficient | 50 Ohms | -8 | dB | ||
| S22 | Output reflection coefficient | 50 Ohms | -8 | dB | ||
(*) Measurement reference planes are the INPUT and OUTPUT plans of the CGY2122XUH MMIC.
 |
Caution: This device is a high-performance RF component and can be damaged by inappropriate handling. Standard ESD precautions should be followed. OMMIC document “OMCI-MV/ 001/ PG” contains more information on the precautions to take. |
Measurements
Conditions: VD1, VD2, VD3, VD4 = 1.1 V; ID1, ID2, ID3, ID4 = 7.5 mA; Tamb = + 25°C
S Parameters
Conditions: VD1, VD2, VD3, VD4 = 1.1 V; ID1, ID2, ID3, ID4 = 7.5 mA; Tamb = + 25°C
| GHz | |S11| | S11 Phase | |S21| | S21 Phase | |S12| | S12 Phase | |S22| | S22 Phase |
| 25 | -12,61 | -99,97 | 34,41 | 166 | -64,07 | 71,82 | -9,331 | -71,86 |
| 25.5 | -13,71 | -89,22 | 33,85 | 150,9 | -60,6 | 62,18 | -10,68 | -76,57 |
| 26 | -12,89 | -83,71 | 33,35 | 137,2 | -57,98 | 25,43 | -11,34 | -81,71 |
| 26.5 | -12,66 | -87,62 | 33,18 | 123,2 | -58,36 | -25,14 | -13,21 | -89,22 |
| 27 | -12,92 | -89,35 | 32,92 | 108,7 | -63,75 | -73,89 | -15,07 | -82,32 |
| 27.5 | -13,32 | -90,94 | 32,65 | 94,77 | -68,43 | -105,4 | -15,41 | -78,69 |
| 28 | -13,33 | -88,29 | 32,5 | 81,99 | -70,44 | -129,5 | -15,68 | -74,86 |
| 28.5 | -13,1 | -86,26 | 32,37 | 69,29 | -65,68 | 174,5 | -15,5 | -71,87 |
| 29 | -12,5 | -89,29 | 32,46 | 57,58 | -61,84 | 99,02 | -15,18 | -74,38 |
| 29.5 | -12,95 | -94,62 | 32,55 | 44,72 | -60 | 24,21 | -16,22 | -74,84 |
| 30 | -14,48 | -88,76 | 32,63 | 33,16 | -60,1 | -46,22 | -15,86 | -61,47 |
| 30.5 | -13,56 | -75,19 | 32,97 | 22,19 | -57,73 | -91,69 | -14,14 | -56,23 |
| 31 | -10,77 | -71,05 | 33,58 | 8,32 | -53,33 | -142,7 | -11,4 | -61,61 |
| 31.5 | -8,622 | -83,57 | 34,05 | -7,907 | -52,37 | 174,1 | -10,48 | -76,38 |
| 32 | -8,411 | -100,6 | 34,02 | -22,77 | -53,19 | 133,1 | -11,18 | -87,66 |
| 32.5 | -9,131 | -108,7 | 34,1 | -35,78 | -54,71 | 114,2 | -11,4 | -86,42 |
| 33 | -9,764 | -113,2 | 34,39 | -48,26 | -55,68 | 101,6 | -10,72 | -87,2 |
| 33.5 | -9,791 | -118,1 | 35,06 | -62,61 | -55,95 | 102,2 | -9,654 | -96,12 |
| 34 | -10,72 | -126,4 | 35,23 | -80,49 | -54,69 | 78,12 | -9,737 | -103,2 |
| 34.5 | -11,66 | -128,2 | 35,17 | -94,46 | -55,81 | 73,9 | -9,297 | -107,9 |
| 35 | -12,44 | -130,4 | 35,33 | -109,5 | -56,6 | 68,63 | -8,766 | -115,2 |
| 35.5 | -14,21 | -128,6 | 35,36 | -123,2 | -54,38 | 62,97 | -8,609 | -124,2 |
| 36 | -14,02 | -114,7 | 36,02 | -138,5 | -55,03 | 32,19 | -7,586 | -134,4 |
| 36.5 | -12,84 | -118,2 | 35,64 | -157,6 | -61,29 | 19,53 | -7,97 | -150 |
| 37 | -12,81 | -123,1 | 35,09 | -172,6 | -65,87 | 36,43 | -8,634 | -162,1 |
| 37.5 | -14,28 | -126 | 34,87 | 173,8 | -59,63 | 95,17 | -10,01 | -173,3 |
| 38 | -15,24 | -113 | 34,37 | 161,6 | -54,85 | 77,21 | -11,21 | -178,8 |
| 38.5 | -14,18 | -104,9 | 34,24 | 149,2 | -54,65 | 58,92 | -11,97 | 173,6 |
| 39 | -13,47 | -100,9 | 33,84 | 138,1 | -52,07 | 50,62 | -13,43 | 168 |
| 39.5 | -10,92 | -105,2 | 33,78 | 125,2 | -50,86 | 19,52 | -13,67 | 161,1 |
| 40 | -10,79 | -113,7 | 33,59 | 113,8 | -54,31 | 1,232 | -14,91 | 147,7 |
| 40.5 | -11,14 | -118,7 | 33,34 | 103,5 | -56,63 | -6,949 | -17,92 | 136,5 |
| 41 | -10,94 | -117,2 | 33,49 | 91,21 | -56,31 | -0,6229 | -20 | 136,6 |
| 41.5 | -11,03 | -117,3 | 33,46 | 80,28 | -57,1 | -1,053 | -21,71 | 130,8 |
| 42 | -10,18 | -117,9 | 33,52 | 67,77 | -57,03 | -8,746 | -23,36 | 135,4 |
| 42.5 | -9,946 | -121,7 | 33,29 | 55,48 | -53,53 | -8,549 | -23,3 | 113,8 |
| 43 | -9,906 | -127,1 | 33,4 | 46,13 | -53,55 | -34,19 | -25,83 | 83,56 |
| 43.5 | -9,679 | -124 | 33,53 | 34,34 | -54,22 | -53,61 | -29,87 | 60,34 |
| 44 | -9,162 | -123,9 | 33,65 | 23,29 | -56,49 | -73,91 | -25,79 | 22,41 |
| 44.5 | -8,749 | -125,7 | 33,86 | 11,91 | -56,58 | -89,48 | -24,97 | -11,72 |
| 45 | -8,225 | -124,3 | 34,05 | 0,7534 | -57,86 | -110,6 | -23,55 | -19,59 |
| 45.5 | -7,125 | -128,6 | 34,42 | -10,96 | -58,8 | -145,9 | -19,81 | -22,81 |
| 46 | -6,583 | -132,8 | 34,96 | -22,16 | -59,42 | -159 | -15,84 | -30,79 |
| 46.5 | -5,305 | -137,9 | 35,53 | -36,3 | -58,73 | 169,5 | -12,64 | -49,51 |
| 47 | -4,723 | -145 | 36,17 | -49,62 | -57,84 | 143,8 | -10,27 | -71,04 |
| 47.5 | -4,302 | -153,5 | 36,76 | -66,73 | -57,26 | 128,7 | -9,519 | -91,24 |
| 48 | -4,087 | -162,5 | 36,94 | -83,22 | -55,98 | 110,1 | -8,777 | -108,9 |
| 48.5 | -4,185 | -169,4 | 37,32 | -101,5 | -55,85 | 93,54 | -8,954 | -124,2 |
| 49 | -4,42 | 179,6 | 36,82 | -124,4 | -54,37 | 86,84 | -8,767 | -137,8 |
| 49.5 | -5,162 | 174,9 | 36,12 | -137,8 | -53,27 | 80,12 | -9,365 | -151,4 |
| 50 | -5,678 | 167,7 | 35,21 | -153,3 | -51,9 | 70,97 | -9,648 | -160,4 |
| GHz | |S11| | S11 Phase | |S21| | S21 Phase | |S12| | S12 Phase | |S22| | S22 Phase |
Information
Noise Figure
Conditions: VD1, VD2, VD3, VD4 = 1.1 V; ID1, ID2, ID3, ID4 = 7.5 mA; Tamb = + 25°C
Figure 5 Noise Figure vs Frequency measurements
APPLICATION INFORMATION
Typical application scheme
A recommended module layout is proposed below. In the reference design, RF input and output are using coplanar transmission lines, microstrip transmission lines can also be used with similar performances. Due to the very high frequency, all path lengths and physical sizes of components should be minimized.
Both RF input and output bonding inductances should be minimized to give the best performance. Overall wire length should be kept as short as possible to reduce parasitic inductance. Degradation of gain and match will be evident at higher RF input and output inductances. Ribbon bonding technique can also be used.
All others bonding inductances (pads VD1, VD2, VD3, VD4, and VG1, VG2, VG3, VG4) should be kept as short as possible.
Decoupling chip capacitors 47 pF and Surface Mount Devices capacitors of 100 nF can be used to improve the power supply rejection and prevent unwanted inside and outside bandpath oscillations.
The chip itself has via holes connecting the front side to the back side of the chip. A good RF grounding connection should be maintained between the backside of the chip and system ground. It is key to use an uninterrupted ground plane. AuSn solder or silver conductive epoxy material can be used for capacitors and die attach.
The reference board is using Southwest removable millimeter wave connectors.
Figure 6 CGY2122X reference board
The layout of the decoupling capacitor are shown below, it can be noticed that drain and gates are carefully decoupled. Bondings between die pads and chip capacitors should be kept as short as possible reducing the equivalent inductance. A 47pF chip capacitor is connected to each DC pad, it is also recommended to insert a second row of 100 nF CMS capacitor in cascade on gates and drain supply connections.
The capacitors present on gates can form with a serie resistor a low-pass filter slowing down the activation in case of grid control.
Figure 7 Typical application layout
Bill of Materials
|
COMPONENT |
DESCRIPTION |
|
C5, C6, C7, C8, C9, C10, C11, C12 |
47 pF Chip Capacitor |
|
R1, R2, R3, R4 |
1 kΩ Resistor |
|
C1, C2, C3, C4, C13, C14, C15, C16 |
100 nF SMD Capacitor |
Pad & Package
BONDINGS PAD COORDINATES
Figure 8 Bondings pad coordinates
PINOUT
The amplifier has a North and South face, North is top and South is Bottom when RF input is on the left and RF output on the right.
| Symbol | Pad | Description |
| RFOUT | OUT | RF output |
| RFIN | IN | RF input |
| VD1 | VD1 | First stage Drain |
| VD2 | VD2 | Second stage Drain |
| VD3 | VD3 | Third stage Drain |
| VD4 | VD4 | Forth stage Drain |
| VG1 | VG1 | First stage Gate |
| VG2 | VG2 | Second stage Gate |
| VG3 | VG3 | Third stage Gate |
| VG4 | VG4 | Forth stage Gate |
| GND1 | GND1 | Ground |
| GND2 | GND2 | Ground |
| NC | NC | Unconnected pad |
| GND | BACKSIDE | Ground |
Note:
In order to ensure good RF performances and stability It is key to connected to the ground the metalized backside of the die.
Package
|
Type |
Description |
Terminals |
Pitch (mm) |
Package size (mm) |
|
DIE |
100% RF and DC on-wafer tested |
10 |
- |
3 x 2 x 0.1 |
Soldering
To avoid permanent damages or impact on reliability during soldering process, die temperature should never exceed 330°C.
Temperature in excess of 300°C should not be applied to the die longer than 1mn Toxic fumes will be generated at temperatures higher than 400°C
Datasheet & Order Code
Document Download
ORDERING INFORMATION
|
Generic type |
Package type |
Version |
Sort Type |
Description |
|
CGY2122X |
UH |
C2 |
- |
On-Wafer measured Die |
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